News

Industry news

Company news

LED packaging structure, process development status and trend

Release Time:

2022-05-17 17:11

The functions of the LED package mainly include:

1. Mechanical protection to improve reliability;

2. Strengthen heat dissipation to reduce chip junction temperature and improve LED performance;

3. Optical control, improve light extraction efficiency, optimize beam distribution;

4. Power management, including AC/DC conversion, and power control.

LED packaging is a technology involving multiple disciplines (such as optics, thermals, mechanics, electricity, mechanics, materials, semiconductors, etc.). (As shown in Figure 1) From a certain point of view, LED packaging is not only a manufacturing technology (Technology), but also a basic science (Science), excellent packaging engineers need to understand thermal, optical, material and process mechanics Have a deep understanding of the nature of physics. Recently, chip-level packaging CSP has attracted everyone's attention. Therefore, the current and future LED packaging technology needs to be carried out at the same time in LED packaging design and chip design, and needs to consider the performance of light, heat, electricity, structure, etc. uniformly. In the packaging process, although the selection of materials (heat dissipation substrate, phosphors, potting glue) is very important, the packaging structure (such as thermal interface, optical interface) also has a great impact on LED light efficiency and reliability. High-power white LED packaging New materials, new processes, and new ideas must be adopted. Small pitch or Mini LED packaging technology requires a deeper understanding of flip-chip and reflow or eutectic flip-chip packaging processes. For LED technology practitioners, in addition to cost efficiency and reliability, it is necessary to consider the integration of light sources, heat dissipation, power supply and lamps. This white paper discusses the current status and future of LED packaging technology, and then analyzes the technology and product trends of LED packaging in the future.

Latest News

图片名称

2022-05-17

LED packaging structure, process development status and trend

LED packaging is a technology involving multiple disciplines (such as optics, thermals, mechanics, electricity, mechanics, materials, semiconductors, etc.). (As shown in Figure 1) From a certain point of view, LED packaging is not only a manufacturing technology (Technology), but also a basic science (Science), excellent packaging engineers need to understand thermal, optical, material and process mechanics Have a deep understanding of the nature of physics.

Read More →
图片名称

2022-05-17

From chip to package to terminal, interpret the development status of UVC LED

In the past two years, affected by the global economic downturn and geopolitical conflicts, the growth rate of the global LED lighting market has slowed down significantly.

Read More →
图片名称

2022-05-17

LED packaging form and packaging process

LED chip types are mainly divided into three categories from a structural point of view: horizontal electrode chips, flip chips and vertical electrode chips.

Read More →