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2022-05-06 21:04
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2022-05-17
LED packaging structure, process development status and trend
LED packaging is a technology involving multiple disciplines (such as optics, thermals, mechanics, electricity, mechanics, materials, semiconductors, etc.). (As shown in Figure 1) From a certain point of view, LED packaging is not only a manufacturing technology (Technology), but also a basic science (Science), excellent packaging engineers need to understand thermal, optical, material and process mechanics Have a deep understanding of the nature of physics.
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From chip to package to terminal, interpret the development status of UVC LED
In the past two years, affected by the global economic downturn and geopolitical conflicts, the growth rate of the global LED lighting market has slowed down significantly.
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LED packaging form and packaging process
LED chip types are mainly divided into three categories from a structural point of view: horizontal electrode chips, flip chips and vertical electrode chips.
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